3D打印与激光烧结介质+导体双层厚膜显微结构研究
吴向东 （ 中国电子科技集团公司第四十三研究所 微系统安徽省重点实验室 ）
刘俊夫 （ 中国电子科技集团公司第四十三研究所 微系统安徽省重点实验室 ）
王之巍 （ 合肥工业大学材料工程学院 ）
张 景 （ 中国电子科技集团公司第四十三研究所 ）
https://doi.org/10.37155/2717-5170-0506-25Abstract
为拓展3D打印工艺在厚膜混合集成电路领域的应用，提升厚膜烧结效率和工艺研发效率，本文采用3D 直写 激光烧结法制备介质 导体浆料双层复合厚膜，并与用传统丝网印刷 高温炉烧结方法制备的相同浆料双层厚膜 样品进行对比实验，对其显微结构进行评价。结果表明，两种工艺制备的介质 导体厚膜表面平整连续，厚度均匀， 但3D直写 激光烧结形成的厚膜导体孔隙较多，介质浆料厚膜烧结程度较低。 3D直写制备厚膜导体和介质浆料具有可 行性，对介质浆料厚膜而言，除了激光烧结参数的优化外，可以通过高温炉二次烧结进行后处理，以图实现烧结致密 化，提高其与基板间的结合强度。
Keywords
厚膜混合集成电路； 3D直写；激光烧结；显微结构Full Text
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additive manufacturing for high-performance mechatronic
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interfaces, 2022, 33: 102209.
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影响[J]. 电子元件与材料, 2022, 41(11): 1245-1250.
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glass sealants with Ag nanoparticles prepared by a heat
reduction process[J]. Journal of non-crystalline solids, 2014,
394: 22-28.
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conductive thick film by low-temperature sintering of silver
paste containing a Bi2O3-B2O3-ZnO glass frit[J]. Journal of
materials processing technology, 2019, 267: 61-67.
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滨: 哈尔滨工业大学, 2018.
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阻复合厚膜烧结起泡及其消除[J]. 电子元件与材料, 2019,
38(12): 54-61.
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additive manufacturing of metallic components: materials,
processes and mechanisms[J]. International materials reviews,
2012, 57(3): 133-164.
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experimental design approach to selective laser sintering
of low carbon steel[J]. Journal of materials processing
technology, 2003, 136(1-3): 151-157.
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journal, 1995, 1(1): 26-36.
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titanium net shapes by SLS HIP[J]. Materials & design, 1999,
20(2-3):115-121.
Kumar S, Kruth J P. Effect of bronze infiltration into
laser sintered metallic parts[J]. Materials & design, 2007,
28(2): 400-407
Copyright © 2023 吴向东,刘俊夫,王之巍,张 景
Publishing time:2023-09-06
This work is licensed under a Creative Commons Attribution 4.0 International License
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