Thermo-structural Coupled Optimization of a HighPower-Density DC Power Supply Chassis

Qing-Yang Zhong （ Beijing Aerospace Wanyuan Science & Technology Co., Ltd. Beijing 100176 ）

Da-Li Qi （ Beijing Aerospace Wanyuan Science & Technology Co., Ltd. Beijing 100176 ）

Sheng-Bo Xia （ Beijing Aerospace Wanyuan Science & Technology Co., Ltd. Beijing 100176 ）

Ren-Rui Xiang （ Beijing Aerospace Wanyuan Science & Technology Co., Ltd. Beijing 100176 ）

Abstract

High-power-density DC power supply enclosures, operating within confined spaces, are simultaneously subjected to high heat flux density and complex mechanical loads. Consequently, thermostructural coupling has emerged as a critical bottleneck constraining their reliability. This paper takes such an enclosure as a case study, systematically analyzing the characteristics of heat source distribution and the features of the structural loading. A thermo-structural coupled finite element analysis (FEA) model is established to elucidate the interaction mechanism between the temperature and stress fields. Building on this, a synergistic design strategy is proposed, integrating heat dissipation topology optimization with structural lightweighting. Through measures such as optimizing the fin layout, reconfiguring the air duct, and adjusting the mounting position, a comprehensive enhancement of both thermal performance and structural strength is achieved. The study demonstrates that the optimized enclosure exhibits significant improvements in its maximum temperature, maximum equivalent stress, and first-order natural frequency, providing effective support for the integrated design of high-power-density power supply enclosures.

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